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IMG1

Submicron hollow silica powders are ready to supply for 5G application. To help dispersibility in customers’ formulation, surface modification is available For further information,please contact us.


Highlights

01. Real spherical shape
02. Inert and safe material
03. Extremely low density
04. Low specific surface area (BET)
05. Low dielectric constant
06. Low dielectric loss
07. Good comparable property with PI and LCP
08. High strength
09. Low moisture absorption

Applications

01. Filler for substrates of 5G (FCCL/Rigid PCB)
02. Filler for adhesive materials for having low dielectric constant
      and low dielectric loss at 10GHz

Specifications
Specifications


Customization Available
  • Variety of particle sizes
  • Various surface treatments