Submicron hollow silica
powders are ready to supply
for 5G application.
To help dispersibility in
surface modification is available.
For further information,please contact us.
01. Real spherical shape
02. Inert and safe material
03. Extremely low density
04. Low specific surface area (BET)
05. Low dielectric constant
06. Low dielectric loss
07. Good comparable property with PI and LCP
08. High strength
09. Low moisture absorption
01. Filler for substrates of 5G (FCCL/Rigid PCB)
02. Filler for adhesive materials for having low dielectric constant
and low dielectric loss at 10GHz